Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
نویسندگان
چکیده
Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 9 10 A/cm for 168.5 h at 150 C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu6Sn5 phase replaced the Ni5Zn21 phase at the Ni/SnZn interface, whereas at the Cu/Sn-Zn interface, a thicker b-CuZn phase replaced the Cu5Zn8 phase.
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